MIL STD 883 is a test method used in the semiconductor and microelectronics industry to determine the integrity of the connection between a semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on the measurement of adhesion force between the die/package and the substrate, and is useful for testing microelectronic components or electronic packages such as IC chips, BGA, QFN, CSPs, and Flip Chips. MIL STD 883 is an ideal method for measuring the shear force required to to initiate failure of glue, solder, and sintered silver bonded areas.
