- JEDEC JESD22B113
- High Cycle Fatigue
Written by Fulin Liu and Charlie PryorTHE CHALLENGEBoard Level mechanical tests are an essential quality control test within the microelectronics packaging industry. They provide testing data to support IC components' performance against interconnect failures during shipment and in end-use products where cyclic stresses and shock from impact are experienced.
The standard recommends a specimen design similar in size and layout to a drop Impact test. It specifies the spans and the cyclic amplitude, frequency, and waveform for performing this test. Interconnection failure is determined based on resistance daisy chains, typically five times the initial resistance or 1000ohms, whichever is higher. The challenge of the JEDEC JESD22B113 test that an operator must have the test system continuously generate the flexural loading based on a specified cyclic waveform on the printed wiring board (PWB) via the 4-point bend to long-time fatigue – up to 200,000 cycles at 1-3Hz frequency without lateral specimen shifting.
The JEDEC B113 test fixtures CP111414 and CP118691 are specially designed in accordance with the JEDEC JESD22B113 method for performing long-time cyclic 4-point flexural fatigue tests. Easy setup of removable specimen stops is to prevent undesired drifting of the specimen during the cyclic test. As a displacement-controlled test, the fixtures are designed to allow for up to 4 PWB specimens to be tested simultaneously in one setup, which saves time.
JEDEC B113 Fixture
2527 系列载荷传感器设计用于动态测试系统；性能卓越，能够测量低至力容量 1/250 的力，精度为读数的 0.5%。自动传感器识别和电气校准功能使得它们非常易于使用。载荷传感器可承受的载荷高达力容量的 150%，而不会损坏，并且可以承受 300% 的载荷而不会出现机械故障。所有的 Instron 载荷传感器均经过单独的温度补偿，并使用可溯源至国际标准的校准设备进行了精度和可重复性测试，测量的不确定度不超过载荷传感器所允许误差的三分之一。